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OSFP

The OSFP interconnect system has 60 contacts per port and supports 16 high speed pairs. With a 0.6mm contact pitch, 4 rows of contacts and a horizontal port pitch of 23.38mm, the OSFP footprint is optimized for signal integrity performance. The stacked connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications. An integrated heat sink for optimal thermal performance is a feature of the design.

Materials Specifications

Housing
LCP
Contacts Base Material
Phosphor Bronze
Contact Normal Force
50 grams
Plating Press-Fit Area
Gold
Plating Mating Area
Tin
Operating Temperature
-40°C to +85°C(105 °C)
PCB Thickness(Cage)
1.57 mm (0.062 in.)

Electromechanical Specifications

Mating Force
20 N max
Durability
250 mating cycles min.
Unmating Force
6.5 N max.
Operating Voltage
30 V AC per contact
Operating Current
0.5 per contact
Differential Impedance
100 Ω +/- 10 Ω

Environmental Specifications

  • Footprint

    This product is designed to reduce the footprint to allow for more board real estate and capture a slim and small design for your solution.

  • Halogen Free

    Again we want to preserve the earth by making our products free of elements that could harm it. ExpressPort SFP+ materials do not contain any compounds derived from harmful halogen elements.

  • Reach Compliant

    ExpressPort SFP+ like all other Amphenol products follow the Reach complacency. Some materials are hazardous to the environment and pollute landfills. Amphenol wants to perserve our earth by using non hazardous materials.

  • Flammability

    Flammability Rating UL 94V-0

  • RoHS Complaint

    ExpressPort SFP+ like all other Amphenol products follow the RoHS complacency. Some materials are hazardous to the environment and pollute landfills. Amphenol wants to perserve our earth by using non hazardous materials.

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